Asia's Semiconductor Surge

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The Semiconductor Asia Summit 2025

Forge vital connections, gain cutting-edge insights, and collaborate on innovations that will shape Asia’s Semiconductor industry future.
The Semiconductor Asia Summit 2025, to be held in Malaysia, is poised to be a pivotal gathering for the Southeast Asia semiconductor industry. Bringing together industry leaders, policymakers, and experts, the forum will delve into the latest advancements in semiconductor technology and explore opportunities for localization Asia.

You will meet exceptional speakers discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by device makers, equipment and materials suppliers, and academics.
It serves as a exhibition too showcasing the world’s latest technologies, solutions and services advancement in the semiconductor sector.
Join Asia’s Premier Event for Semiconductor Innovation
The Semiconductor Asia Summit 2025 brings together industry leaders, policymakers, and innovators to shape the future of the semiconductor industry. This summit offers a platform to explore cutting-edge technologies, foster strategic partnerships, and address key challenges in localization and sustainable manufacturing.

Network with top experts, discover new opportunities, and witness groundbreaking innovations driving the semiconductor ecosystem forward.

  • 300+

    Attendees

  • 30+

    Speakers/ panelists

  • 100+

    Companies/ Organizations

  • 15+

    Event Partners

  • 10+

    Media Partners

  • 81%

    C-level executives

  • 10+

    Solutions Providers

  • 100+

    CXOs Attending

Key Topics
Asia’s Semiconductor Market Trends and Ecosystem
Malaysia’s Semicon Expansion
Technology Advancement
Advance Packaging Solutions
Packaging Innovations
The Future of Test Engineering
Exploring the AI Revolution
Intelligent manufacturing
Sustainability
Local talent pool development
Who Attend?
The Summit connects key decision makers in the full spectrum of the semiconductor value chain. Such as Materials and Equipment suppliers, Foundries, IDMs, Production, Fabless companies, OSAT, EDA, IP Core providers, Distributors, End Users, R&D, Gov Regulatory bodies, consulting.
Sample of our Invited Attendees
  • Advanced Packaging Solution
  • Advanced Testing Solutions
  • AI Smart Factory Solution
  • Analytical, Calibration, Certification
  • Cables, Connectors, Junction Boxes
  • Chemicals and Gases
  • Consulting
  • Cybersecurity
  • Digital Manufacturing
  • Digital Solutions & Software Technology
  • Electronic Components Production Machine
  • Electronic Design Services
  • Electronic Materials
  • Environment, Health & Safety
  • Fab Environment Monitoring System
  • Flexible, Hybrid Electronics
  • Heterogeneous Integration
  • High Precision Processing Technology
  • Laser Drilling & Cutting Machine
  • Logistics Services
  • Measurement, Monitoring and Control Systems
  • MEMS & Sensors
  • Nano-Bio Materials
  • Professional Services
  • Robotics and AI solutions
  • Semiconductor Manufacturing
  • Silicon Substrate Manufacturing Equipment
  • Software
  • Subsystems & Components
  • Sustainability, ESG
  • Vacuum Technical Equipment & Parts
  • Wastewater & Gas Treatment Solution
WHO SHOULD SPONSOR/EXHIBIT
Confirmed Speakers & Panelists
Agenda
08:00

Registration & Morning Coffee

08:55 - 09:00
Opening Remarks
Chairman of Conference : Ir. Dr. Bernard Lim - Vice President of The Institution of Engineers, Malaysia (IEM) and IPC - Advisor & Lead Consultant - South East Asia
09:00 – 09:20
Keynote

The Shifting Global Semiconductor Landscape in Asia-Pacific

Speaker : Mr. ET Tan - Board of Directors (BOD) at MIMOS Berhad Malaysia
09:20 – 09:50
Presentation - Slot Reserved for Nordson
09:50 – 10:30
Panel Session

Emerging Resilience in the Semiconductor Supply Chain in Asia and the World

Panel 1 : Chian Min Liong - Managing Director at Renesas
Panel 2 : J-Wing Teh - Director of Silicon Design Engineering at AMD

(open to Moderator and Panelist Role)
10:30 – 11:00

Morning Tea Break

11:00 – 11:20
Presentation - Topic TBA
Speaker : Desmond Pan – Technical Specialist in Dispensing Solution and Automation Integration at Kulicke & Soffa Pte Ltd
11:20 – 11:40
Presentation
Efficiency and Sustainability in Silicon Carbide Wafter Production by Way of Rapid Crystal Orientation Analysis by Azimuthal XRD scanning
Speaker : Dr. Plex Lee, Malvern Panalytical Applications Team Leader
11:40 – 12:10
Panel Session - Digital Transformation for Sustainability: Empowering the Semiconductor Industry through AI and Green Practices
Moderator : Sivavenayakam Velayutham – Executive Committee at MAJECA (Malaysia-Japan Economic Association)

Panelist :
  1. Davis Chong – President of Malaysian Photovoltaic Industry Association (MPIA) and Group CEO at Solarvest Holdings Berhad
  2. Sachin Gupta - Global Sustainability Industry Leader | APAC Sales Leader at IBM
12:10 – 12:30
Presentation - Slot Reserved for Event Sponsor
12:30 – 13:30
Lunch Break
13:40 – 14:10

Presentation

Manufacturing Foundation System Readliness for Advanced Packaging

Speaker : Meng Kuang Koh - Chief Technology Officer at Alpha X Technology
14:10–14:40

Presentation

Advanced Chip Packaging: How Manufacturers Can Play To Win

Speaker :
  1. Dr. Ranee Ramya - Country Manager for Malaysia at IPC International Inc.
  2. Ir. Dr. Bernard Lim - Advisor & Lead Consultant - South East Asia at IPC International Inc.
14:40 – 15:10
Presentation

Adapting to 21st Century E&E Advanced Packaging Trends: Leveraging NSW’s Next-Generation Micro-Dispensing Technologies for Emerging Innovations

Speaker : Tai Kian Chong - Marketing Director at NSW Automation
15:10 – 15:40
Afternoon Tea Break
15:40 – 16:10
Presentation
Transformation Through Innovation in Automotive Semiconductor Packaging
Speaker : Dr. Poh Leng - Senior Director of External Package Innovation - Chief Technology Office at NXP Semiconductors
16:10 – 16:50
Panel Session

The Power of AI in Semiconductor Manufacturing

Moderator : Angel Low - General Manager of Advanced Semiconductor Academy of Malaysia (ASEM), AI Nusantara

Panelist :
  1. Gary Leong - Senior Director, Analytics Intelligence Solutions (AIS) at ViTrox Corporation Berhad
  2. Dr. Angie See Tien Ng – AI Principal Engineer, Technical Director & Application Engineering Lead at Intel Corporation
  3. Kee Sim Cheng - Manufacturing Chief Engineer | Tech Lead at Altera
16:50 – 17:00

Closing Remarks + Post Event Networking

17:10

End of Day One

08:00 – 09:00

Registration & Morning Coffee

09:00 – 09:30
Keynote

*Topic TBA

Speaker : Mazlan Mokhtar - Director of the Electrical & Electronics Division at Malaysian Investment Development Authority (MIDA)
09:30 – 09:50

Presentation

Heterogeneous Integration (HI): Challenges and Advances

Speaker : Eric Lee - President of the Sales Group at Scientech Corp.
09:50 – 10:30
Panel Session

Sustainable Semiconductor/Electronic Manufacturing

Moderator : Dr. Chin Seong Lim - Malaysia Director, Head of Department (Electrical & Electronic Engineering) at University of Nottingham

Panelist :
  1. Susan Goh - Group VP Central Material Engineering at STMicroelectronics
  2. Jaffri Ibrahim - Founder & CEO of Collaborative Research in Engineering, Science and Technology (CREST)
10:30 – 11:10

Morning Tea Break

11:10 – 11:40
Presentation
*Topic TBA
Speaker : Melvin Tan – Technical Solution Manager at Kulicke & Soffa Pte Ltd
11:40 – 12:20
Panel Session
The Future of Semiconductor Packaging: Advanced Techniques and Materials
Moderator : Associate Professor Ts. Dr. Mohd Zamir Pakhuruddin - Director at Institute of Nano Optoelectronics Research and Technology (INOR), Universiti Sains Malaysia (USM)

Panelist :
  1. Dominic Koey - Technical Director, Package Innovation at NXP Semiconductors
  2. Dr. David Lacey - Director, Advanced Development & Services, R&D at ams OSRAM
  3. Adlil Aizat - Program Manager Product Development at Western Digital
12:20 – 13:30
Lunch Break
13:40 – 14:10

Presentation

Melaka Industries and Sustainable Transformation

Speaker : Datuk Ginie Lim – Chief Executive Officer of Invest Malaka
14:10 – 14:40
Presentation

Talent Pipeline: Building a Sustainable and Diverse Semiconductor Workforce in Southeast Asia

Speaker: Dr. Murugappan - Chief Human Resources Officer at Malaysian Communications and Multimedia Commission
14:40–15:10

Presentation - Slot Reserved for Event Partner

15:10 – 15:40
Afternoon Tea Break
15:40 – 16:10
Presentation

IC Design & Services in Southeast Asia vs International Market Demand

Speaker : Soon Lee Yeap - Executive Vice President at Oppstar berhad
16:10 – 16:40

Presentation - Slot Reserved for The Institution of Engineers, Malaysia (IEM)

*Topic TBA

Speaker : Ir. Dr. Bernard Lim - Vice President of The Institution of Engineers, Malaysia (IEM)
16:40 – 17:00

Closing Remarks + Post Event Networking

17:00

End of Day Two

Event Format
Conference

A gathering of semiconductor industry leaders, engineers, and innovators to exchange insights, explore the latest advancements, and network with peers.

Exhibition
Discover cutting-edge technologies and solutions from global leaders in semiconductor manufacturing, design, and testing.
1-1 Meetings

Meet potential business partners in private, pre-scheduled meetings, curated to match your specific interests and goals.

Peer Networking

Expand your professional network and explore new business opportunities with industry experts across the semiconductor landscape in Malaysia.

You'll Experience

Your Benefits of Attending as a Delegate

Access to all event programs & networking sessions

Receive the full event documentations

Receive the presentation Copies of the speakers

Five Star Food, Drinks and amenities

Receive your Delegate Certificate

Access to LuckyDraws (MacBook/iPhone/iPod ...)

Delegate Pass
Early Bird Delegate Pass
$0

Limited to government officials, managers, directors, and C-level delegates from design companies (IC & IP providers) and fabrication (foundry) companies.


(There are 200 Limited FREE passes only.)

Standard Delegate Pass
$390

Limited to government officials, managers, directors, and C-level delegates from design companies (IC & IP providers) and fabrication (foundry) companies.


(After the early bird pass ran out.)

Vendor Pass
$890

Vendors, suppliers, solution providers, and individuals who do not meet the VIP delegate criteria will be required to pay registration fees, which vary depending on the nature of their business.


  • The Early Bird Vendor Pass - book and pay by Jan 31 - 890 USD
  • The Standard Vendor Pass - book and pay after Feb 1 - 990 USD
Official Event Sponsors & Partner
  • Malvern Panalytical
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  • Nordson Test & Inspection
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  • Alpha X Technology Pte. Ltd.
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  • Kulicke & Soffa
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  • Scientech Corp.
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  • Tekmark Sdn Bhd
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  • GrabTaxi Holdings Pte. Ltd.
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  • Pacific Adhesive Systems (M) Sdn Bhd
    Show more
  • NSW Automation
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  • TERA VA SDN BHD

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  • AEROTECH
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  • PVA TePla AG
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  • SignOff Semiconductors
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  • IPC International Inc.
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  • The Institution of Engineers, Malaysia
    Show more
  • Asia Business Outlook
    Show more
  • CEO Insights
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  • EE Times
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  • PCB Directory
    Show more
Sponsorship Opportunities
The conference gathers HR project owners, buyers, and decision-makers from the Southeast Asia region, making it the ideal place to showcase your products directly to your customers.
Tailored presentation, exhibition booths, one to one meetings with delegates on your wish-list, branding and promotion, we will set up everything you need to make sure you get connected with the right people
Venue & Floorplan
Pavilion Hotel Kuala Lumpur Managed By Banyan Tree
Grand Ballroom
Getting in Touch
Sponsorship & Exhibition

Daniel Tran, Event Director
M: +84 869 257 920 (WhatsApp)
E: daniel.tran@escom-events.com



Speaking Slot & Partnership

Febby Azizah, Sr. Conference Producer

M: +62 899 031 7571 (WhatsApp)

E: febby.azizah@escom-events.com



Delegate Pass

Ananda Louded, Project Manager

M: +62 882 2485 9757 (WhatsApp)

E: ananda.louded@escom-events.com



You can also send us a message via the form on the right.

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